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The Execution Fabric
for Modern Compute

Workloads have changed shape. Execution models haven't. TAHO Labs is on a mission to fit the work to the machines so the compute you already own finally does everything you paid for. Any hardware, any orchestrator, anywhere.

The problem

The execution gap

Peak compute per chip has risen roughly twenty times in eight years, but realized compute barely moved. Today's GPUs typically run at about 5% utilization across production clusters*.

The execution gap is the expanding pool of capacity that was paid for, powered, cooled, and never converted into useful work. Every bigger chip widens it. We founded TAHO Labs to solve it.

Chips progress, but capacity waste continues.

0%25%50%75%100%Share of peak2017Volta2020Ampere2022Hopper2024Blackwell2025BlackwellUltra2026RubinUNUSED CAPACITY
100% peak
47% best
18% typical

Sources: NVIDIA datasheets (Volta–Blackwell Ultra, FP16 dense); Rubin projected. Best-tuned MFU from Meta Llama 3, 2024. Typical from Cast AI 2026 (~23,000 production clusters).

The solution

Change the unit of execution.

Today, you reserve a whole machine for a workload that doesn't fit, so part of your processor struggles while most of it sits idle. TAHO splits the workload into small jobs and routes each to the resource that fits, so your hardware runs full instead of empty.

Traditional

Workload
GPU
PoorFitStruggles
idle capacity

18% used

Place the whole workload on a machine. Most of it sits idle.

TAHO

Workload
Units
CPU
GPU
Accelerator
Edge

90% used

Decompose into small jobs (units). Route each to the resource that fits. Execute densely.

The payoff

Get what you paid for.

Up to
10× faster execution
Up to
90% lower compute cost

Both come from one move: packing the hardware you already pay for instead of leaving it idle.

Where TAHO lives

Below orchestration. Above silicon.

Jensen Huang says that AI is a five-layer cake: energy, chips, infrastructure, models, and applications. In this model, TAHO lives at the base of the infrastructure layer, directly above the silicon and underneath everything else.

TAHO's execution fabric removes compute bottlenecks. Everything gets faster and more affordable.

L5
Applications
L4
Models
L3Infrastructure
OrchestrationKubernetes, SLURM
LLM serving frameworksvLLM, TensorRT-LLM
Caching & data fabric

TAHO

Execution fabric, just above the silicon.

L2Silicon
L1
Energy

Compatibility

Nothing to rip out.
Nothing to rewrite.


Works with what you run

TAHO sits beneath your orchestration and serving layers. Everything above it keeps working, only faster.

  • Kubernetes
  • SLURM
  • NVIDIA
  • AMD
  • CUDA
  • ROCm

Runs where you run

Deploy on the infrastructure you already have: one environment, or across multiple clouds.

  • Cloud
  • On-prem
  • Edge

Prove it in your stack

Bring a real workload. Experience the difference.

Available in cloud marketplaces
  • aws
  • Microsoft
  • Google CloudComing soon